- The Problem: Produce 1,000,000 parts per day, using 50µm thick die, with no voids and requiring high heat dissipation
- Posted on April 14, 2014
- by Julien Joguet
The power semiconductor market produces more than 170 billion discrete components a year to exacting standards. High volume manufacturing (HVM), cost effective process technology is a must to achieve these goals.
ALPHA® Argomax® Ag sinter film technology solves The Problem. By using Argomax® film, you can produce 1,000,000 parts per day with less capital equipment and less factory floor space when compared to existing processes.
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