Alpha is actively engaged in the Conflict-Free Tin Initiative

Our goal is to provide conflict-free tin to our suppliers, accordingly we have implemented the Alpha Conflict Minerals Policy based on the OECD Framework for Due Diligence.

Conflict Free Minerals

ALPHA® SACX Plus® Alloys Create Value

The SACX Plus® family of RoHS-compliant alloys helps optimize the value of your assemblies. They are easy to use, deliver excellent soldering performance and are highly reliable.

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Experience Lower Processing Costs!

The ALPHA® ASPEN App helps electronic assemblers decide if lower cost low temp processing is a good “fit for use” in their process.

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Alpha's E-newsletter Items Deliver Value Creation News

Read about new R&D Driven Alpha products and technologies that will create value for your electronic assembly process.

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ALPHA® Exactalloy Tape & Reel Packaged Solder Preforms Create Value!

ALPHA® Preforms provide an easy to Implement method for increasing solder volume. They are specifically targeted for use with solder paste in electronic assembly applications.

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ALPHA© CVP-520 Solder Paste Enables ALPHA's Dual Alloy SMT Process™

Now you can reduce your mixed-technology process to a two step SMT-only process using CVP-520, a PB-free, low temperature Solder Paste.

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In Circuit Pin Testing- An excellent potential source of value creation

Posted on June 11, 2013

by Mitch Holtzer

In Circuit Pin Testing (commonly referred to as ICT) is a common method of inspecting electronic assemblies for proper electrical function. Test probes are put in contact with dedicated test points along the surface of an assembly, checking for electrical function (resistance, capacitance, inductance or voltage change). Some assembly customers use functional testing for quality assurance as a substitute for ICT. In this example, the entire assembly either works or it doesn't.

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June 17, 2013: Argomax Newsletter #14
May 31, 2013: Argomax® Newsletter #13
May 28, 2013: Alpha Introduces New ALPHA® LED Materials Technologies

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