- Argomax® Newsletter #21
- Posted on August 27, 2014
- by Julien Joguet
Ultra-Fast Sintering (UFS), 3 words that have never been put together before. ALPHA® Argomax® makes it a reality and is proud to bring to the power semiconductor market the most sophisticated and easy to implement sinter technology for die attach. UFS with Argomax® film is the only High Volume Manufacturing sintering technology that allows you to achieve the economics of epoxy die bonding with traditional equipment.
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