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Argomax® Newsletter #12

The world is constantly changing especially in the energy sector. There are increases in prices (oil and electricity), tighter regulations requiring cleaner energy and more efficient products. The way we manufacture semiconductors is changing, as a result of the above factors.

At Alpha®, we created Argomax® sinter technology to meet these demands. This was a direct response to your expressed concerns and requirements for new packaging materials used in the power semiconductor market.

Argomax® enables new design rules that facilitate the downsizing and weight reduction of your packages. Its high thermal conductivity (200-250 W/m°K) allows new power module designs that can be significantly smaller in area. It is ideal for SiC and GaN devices because high reliability can be achieved even at operating temperatures ≥200°C.

New levels of efficiency can be reached because Argomax® enables packaging configurations that significantly reduce electrical losses. All of this can be gained without sacrificing reliability.

The way our customers are pushing the reliability envelope, demonstrates they understand what Argomax® can bring to them: 1000 hours at temperatures above 230°C or 1000 thermal shocks cycles at a ΔT greater than 270°C. This is a clear example of Argomax® capabilities.

Argomax® is the direct response to the present and future needs of “green” technologies, like wind mills, hybrid electric cars and efficient high speed trains. In other words, Argomax® can help to preserve our environment. It is ready to take on the most demanding applications.

Argomax® is being implemented in high volume manufacturing around the globe using standard equipment at major Power semiconductor and LED companies. These companies take advantage of its technical benefits and its reduced cost of ownership.

Our team of sales and applications engineers stands ready to work with you on your demanding packaging requirements. Contact us for a lab or on-site demonstration at alphadieattach@alent.com

 

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