Enabling Technology

 ELECTRONIC ASSEMBLY

• ALPHA® Solder Paste and Tape and Reel Preforms: An easy-to-implement method for selectively increasing solder volume in through hole and SMT applications.

 POWER ELECTRONICS

• ALPHA® Argomax: Its highly refined sinter technology enables higher throughput and yield to power module and discrete die attach processing.

•  ALPHA® PoP-33 and PoP-707 Solder Paste: Designed for BGA memory packages: minimize rework and scrap by delivering highly repeatable paste volumes

•  ALPHA® Atrox: A die attach paste that delivers excellent heat dissipation and high reliability.

 PHOTOVOLTAIC

• PV Ribbon: Enables efficient, reliable solder interconnects that are critical to maximizing process efficiency and cSi module reliability.

LED LIGHTING

• ALPHA Lumet Solder Paste: Available in a range of alloys, enables: increased efficiency, brightness, reliability and lifetime; and, reduced cost/lumen for LED processing.