The potential challenge of transitioning to lead free solder automotive electronic assemblies is one of the greatest external technical roadblocks to confront this segment in a generation. Key leading automotive OEM decisions to go lead-free five years ago is putting significant competitive pressure on the Western OEMs still processing SnPb.
How is the transition to lead free soldering affecting your production of electronic assemblies?
How well does your materials resource comply with your Production Parts Approval Process (PPAP)? What lead-free yield issues trouble you? How will the lead-free solder transition impact your system reliability?
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