ALPHA® LUMET™P33 Solder Paste
LED
ALPHA® LUMET™P33 is a lead-free, no-clean solder paste designed for a broad range of applications including LED package-on-board assembly. ALPHA® LUMET™P33’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA® LUMET™P33 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA® LUMET™P33 is formulated to deliver exceptional visual joint cosmetics. Additionally, ALPHA®
LUMET™P33’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
*Although the appearance of these lead-free alloys will be different to that of tin-lead, the mechanical reliability is equal to or greater than with that of tin-lead or tin-lead-silver.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.