ALPHA® LUMET™P34 Solder Paste
ALPHA® LUMET™P34 is a lead-free, no-clean solder paste designed for a broad range of applications including LED package-on-board assembly. ALPHA®’s LUMET™P34 is engineered to deliver the comparable performance to a tin lead process. ALPHA® LUMET™P34 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high “through-put” applications. ALPHA® LUMET™P34 is designed for long soak reflow profiles, which are important for assembly on high thermal mass boards such as MCPCBs.
Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA® LUMET™P34 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA® LUMET™P34’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.