Wave Solder Flux
ALPHA EF-6000 was specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, ALPHA EF-6000 exhibits the lowest tendency for solder ball generation over a wide variety of solder masks during wave soldering and Selective Soldering operations. ALPHA EF-6000 should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, or whose specification requires an extremely low frequency of solder balls.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.