Wave Solder Flux
Alpha NR330, formerly development #9225, is a VOC-free, halide-free, rosin/resin-free, low solids, no-clean flux. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill particularly to bare copper with OSP’s. Several proprietary additives are also formulated into NR330 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of NR330 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.