Epibond® Adhesives Selector Guide
Choose a product by clicking on the name below.
(RVT SPINDLE #7) |
| Epibond® 7275 |
Red |
Original formula ideal for each of the deposition methods.
Designed specifically for high speed applications. |
cps @ 1 rpm: 3,200,000
cps @ 10 rpm: 420,000 |
| Epibond® 7275-1 |
Red |
Slightly less viscous modification of the Epibond® 7275. Preferred for certain application equipment. |
cps @ 1 rpm: 2,500,000
cps @ 10 rpm: 320,000 |
Epibond Surface Mount Adhesives
- Non-slumping and non-stringing.
- Room temperature stability.
- Dispense, print and pin transfer application.
- Consistent dot profile and fact curing.
- High-visibility red or yellow options.
- Screen printable with ALPHA CUT laser stencils to SMD adhesive guidelines.
Epibond®* 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond® are high-quality non-slumping and non-stringing surface mount technology adhesives applied by dot dispensing, printing equipment and pin transfer, giving consistent dot profile and fast curing.
Epibond® Surface Mount Adhesives Typical Cure Profile
A correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:
- Ensure the material is heated to the correct temperature for the specific time.
- maximum thermal ramp rate is 1.5 to 2.0°C/second to ensure a homogeneous cure.
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Printed Adhesive |
ALPHA® ■
Epibond Surface Mount Adhesives
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Dispensed Adhesive |
Typical Properties
