Alpha Solder Paste Depositions

ALPHA® Solder Paste

Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications.  Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others.  Alpha’s® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX Plus® that offers excellent soldering performance at an alloy cost approximately 30% less than SAC305.  The SACX Plus® alloy is also offered in Alpha® solder bar, preforms, wire, and spheres for assured alloy compatibility and stronger solder joints.  Alpha’s® solder pastes conform to our customers’ unique processes, as well as the challenging environmental regulations they are required to follow.

Alpha solder pastes are used in the assembly of printed circuit boards (PCBs) for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others.

Alpha® solder paste technology leaders*:

  • ALPHA® CVP-520: zero halogen, low melting point lead-free alloy enables excellent pin-in-through-hole soldering performance and reflow soldering of temperature sensitive through-hole components, potentially eliminating wave soldering in mixed technology applications. 
  • ALPHA® OM-363: excellent fine feature printing and pin test capability; significantly decreases the  non-wet open (NWO) and head-in-pillow (HIP) defects.



Solder Pastes Selector Guide

Choose a product by clicking on the product name below.













Universal, Highest
Print Speed
ALPHA®
OM-338 T
                      88.5%   M13   ROL0 88.3%
 M04
ND
Universal, Pin Testable, Enclosed Print Heads ALPHA®
OM-338 PT
                      88.5% M15 ROL0 NA ND
Enabling 0.4mm BGA Assembly ALPHA®
OM-338 CSP
                        88.3% M11 ROL0 83.5%
M04
ND
High Soak Profile, Paste in Through Hole ALPHA®
CVP-390
          88.8%,
89%
M17
M20
ROL0 TBD ND
Increased Spread Wetting, Excellent HIP ALPHA®
OM-340
          88.3% M18 ROL0 NA ND
Universal Water Soluble ALPHA®
WS-820
                  88.0% M19 ORH0 85%
M9
NA
Low Melting Point Water Soluble ALPHA®
WS-852
                        90% M18 ORH0 NA NA
High Value Pin Testable SACX Alloy ALPHA®
CVP-360
                      88.5% M15 ROM0 83.3%
 M04
<900
ppm
Package-on-Package Dip Paste ALPHA®
PoP-33
                        77.5% M05 ROL0 NA ND
Package-on-Package Dip Tacky Flux ALPHA®
PoP-707
                              NA NA NA NA ND
Jetting Solder Paste ALPHA®
JP-500
                        87% M11 ROL0 NA ND
Excellent paste in through hole performance, low melting point alloy ALPHA®
CVP-520
                        90% M21 ROL0 85.3%
 M04
ND
Solder Paste ALPHA®
OM-5300
                    90% M17 ROL0 NA ND
Universal, Wide Process Window ALPHA®
OM-5100
                    90.0% M13 ROL0 85%
M04
ND
Universal Dispense Paste  ALPHA®
CL-78
                    85.0% M04 ROL0 85%
M04
 
Stencil Life, Joint Cosmetics, Cleanability ALPHA®
WS-809
                      90.0% M18 ORH0 NA NA

© 2013 Alpha, an Alent plc Company