ALPHA® CL-78

Solder Paste

ALPHA CL-78 is a no-clean, dispensable solder paste compatible with the Alpha UP-78 series of modern, no-clean pastes. It is designed for high speed automated or manual dispensing through a wide range of needle sizes. The post reflow residues are clear and colorless.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

Product Documentation

Technical Bulletin: ALPHA CL-78 USA Technical Bulletin; ALPHA CL-78 Europe Technical Bulletin
Application Bulletin: AB - Print Parameters - CNP - WWE - Print Parameters 06-03-02 Application Bulletin; AB - Dual Alloy Soldering - WWE - SM1044 10-11-05 Application Bulletin
Reference Bulletin: Stencil Terminology Reference Bulletin; Visual Inspection Standards Reference Bulletin; RB-Solder Paste Handling Guidelines AM-CNP-USE-SM000-1 08-06-27. Reference Bulletin; RB-Solder Paste Handling Guidelines AP-CNP-USE-SM000-1 10-10-14 Reference Bulletin - Chinese; Aperture Shapes Reference Bulletin; RB-OM-340 Cleaning CNP WWE SM1054. 11.02.18 Reference Bulletin; RB-OM-340 dispense paste handling guidelines Reference Bulletin
Technical Paper: Printing Tutorial (CSR April 2003) Technical Paper; Real Time Visualization (SMT Jan 2003) Technical Paper; Print & Profile Fine Feature (APEX 2003) Technical Paper; TP-Method of Eval ICT Probe Penetrability of Flux Residues (Apex 06)-CNP-WWE--SM000 06-01-02. Technical Paper; New Dim In Stencil Print (SMTA 2002) Technical Paper; RF Characterization of No Clean Solder Flux Residues Technical Paper; Stencil Design for L-F (SMT2004) Technical Paper; Stencil Printing Basics (A. Johnson) Technical Paper; Analytical Procedures for Portable L-F Alloy Test Data Technical Paper; Small Tapered Apertures (Nepcon 2002) Technical Paper; Solder Paste Qualification Paper Technical Paper; TP-Method of Eval ICT Probe Penetrability (Apex 06)-CNP-WWE-SM000 06-01-02 Technical Paper; Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability (SMTAI Oct 2010) Technical Paper; Four Ways to Reduce Voiding in BGACSP Packages To Substrate Connections (SMTA Oct 2010) Technical Paper; The Effect Of Filling Via-In-Pad On Voiding Rates In PWB Assembly For BGA Components Technical Paper; A Procedure to Determine Head in Pillow Defect and Analysis of Contributing Factors SMTAI Oct 2010; Low silver BGA Paper Technical Paper; A New Angle on Printing Technical Paper; TP-Halogens in Lead Free Solder Paste (SMTA 2009) - WWE SM000-4 10-04-15 Technical Paper; High Density Fine Feature (APEX 2001) Technical Paper; Fine Feature Print (APEX 2003) Technical Paper; iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper; SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03 Technical Paper