Solder Paste

ALPHA CL-78 is a no-clean, dispensable solder paste compatible with the Alpha UP-78 series of modern, no-clean pastes. It is designed for high speed automated or manual dispensing through a wide range of needle sizes. The post reflow residues are clear and colorless.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

Product Documentation
Technical Bulletin
ALPHA® CL-78 Technical Bulletin (EN)
Application Bulletin
AB - Print Parameters - CNP - WWE - Print Parameters 06-03-02 Application Bulletin
AB - Dual Alloy Soldering - WWE - SM1044 10-11-05 Application Bulletin
Reference Bulletin
RB-Solder Paste Handling Guidelines AP-CNP-USE-SM000-1 10-10-14 Reference Bulletin - Chinese
Stencil Terminology Reference Bulletin
Visual Inspection Standards Reference Bulletin
RB-OM-340 dispense paste handling guidelines Reference Bulletin
RB-Solder Paste Handling Guidelines AM-CNP-USE-SM000-1 08-06-27. Reference Bulletin
RB-OM-340 Cleaning CNP WWE SM1054. 11.02.18 Reference Bulletin
Aperture Shapes Reference Bulletin
Technical Paper
Real Time Visualization (SMT Jan 2003) Technical Paper
Small Tapered Apertures (Nepcon 2002) Technical Paper
Printing Tutorial (CSR April 2003) Technical Paper
New Dim In Stencil Print (SMTA 2002) Technical Paper
Print & Profile Fine Feature (APEX 2003) Technical Paper
Solder Paste Qualification Paper Technical Paper
Stencil Design for L-F (SMT2004) Technical Paper
Stencil Printing Basics (A. Johnson) Technical Paper
Analytical Procedures for Portable L-F Alloy Test Data Technical Paper
Low silver BGA Paper Technical Paper
Four Ways to Reduce Voiding in BGACSP Packages To Substrate Connections (SMTA Oct 2010) Technical Paper
TP-Method of Eval ICT Probe Penetrability of Flux Residues (Apex 06)-CNP-WWE--SM000 06-01-02. Technical Paper
A New Angle on Printing Technical Paper
iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper
The Effect Of Filling Via-In-Pad On Voiding Rates In PWB Assembly For BGA Components Technical Paper
Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability (SMTAI Oct 2010) Technical Paper
A Procedure to Determine Head in Pillow Defect and Analysis of Contributing Factors SMTAI Oct 2010
SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03 Technical Paper
High Density Fine Feature (APEX 2001) Technical Paper
TP-Method of Eval ICT Probe Penetrability (Apex 06)-CNP-WWE-SM000 06-01-02 Technical Paper
TP-Halogens in Lead Free Solder Paste (SMTA 2009) - WWE SM000-4 10-04-15 Technical Paper
RF Characterization of No Clean Solder Flux Residues Technical Paper
Fine Feature Print (APEX 2003) Technical Paper
RoHS / REACH / Environmental
RoHS ALPHA® CL-78 Solder Paste 63Sn37Pb

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