ALPHA® CVP-360 is a lead-free, halogen free no-clean solder paste designed for a broad range of applications. ALPHA® CVP-360 is designed to enable the use of ALPHA SACX® alloys, while offering reflow process yields comparable with higher silver SAC alloys (SAC 305 and SAC 405). CVP-360 also offers extremely high in circuit pin test yields, which can reduce the circuit board assembly process cycle time due to fewer false negative rework steps. CVP-360’s excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Until now, solder paste with high spread and wetting properties with low silver SAC alloys have had poor in circuit pin test yields, high halogen levels, or both. CVP-360 eliminates the need to compromise properties when using either ALPHA SACX® 0307 or ALPHA SACX® 0807 alloys.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.