ALPHA® CVP-390
Solder Paste
ALPHA® CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, ALPHA® CVP-390 achieves IPC7095 Class III voiding performance.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.