CVP 520 Solder Paste

ALPHA® CVP-520

Solder Paste

ALPHA® CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA® CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA® CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. This product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through hole components are used in an assembly. Eliminating a wave soldering or selective soldering step can significantly lower the cost of producing an electronic assembly, increase daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate the need for pallets. 

The carefully selected Sn/Bi/Ag alloy in ALPHA® CVP-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle based fatigue. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used. The use of ALPHA® Exactalloy™ performs may enable the elimination of selective wave soldering by providing additional solder volume when needed. All components used with ALPHA® CVP-520 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.

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Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

Product Documentation
Technical Bulletin
ALPHA CVP-520 Technical Bulletin (Chinese)
ALPHA CVP-520 Technical Bulletin (English)
Product Guide
ALPHA CVP-520 Product Guide (English)
ALPHA CVP-520 Product Guide (Chinese)
Application Bulletin
AB - Print Parameters - CNP - WWE - Print Parameters 06-03-02 Application Bulletin
AB - Dual Alloy Soldering - WWE - SM1044 10-11-05 Application Bulletin
Reference Bulletin
RB-Solder Paste Handling Guidelines AP-CNP-USE-SM000-1 10-10-14 Reference Bulletin - Chinese
Stencil Terminology Reference Bulletin
Visual Inspection Standards Reference Bulletin
RB-OM-340 dispense paste handling guidelines Reference Bulletin
RB-Solder Paste Handling Guidelines AM-CNP-USE-SM000-1 08-06-27. Reference Bulletin
RB-OM-340 Cleaning CNP WWE SM1054. 11.02.18 Reference Bulletin
Aperture Shapes Reference Bulletin
Technical Paper
Real Time Visualization (SMT Jan 2003) Technical Paper
Small Tapered Apertures (Nepcon 2002) Technical Paper
Printing Tutorial (CSR April 2003) Technical Paper
New Dim In Stencil Print (SMTA 2002) Technical Paper
Print & Profile Fine Feature (APEX 2003) Technical Paper
Solder Paste Qualification Paper Technical Paper
Stencil Design for L-F (SMT2004) Technical Paper
Stencil Printing Basics (A. Johnson) Technical Paper
Analytical Procedures for Portable L-F Alloy Test Data Technical Paper
Low silver BGA Paper Technical Paper
Four Ways to Reduce Voiding in BGACSP Packages To Substrate Connections (SMTA Oct 2010) Technical Paper
TP-Method of Eval ICT Probe Penetrability of Flux Residues (Apex 06)-CNP-WWE--SM000 06-01-02. Technical Paper
A New Angle on Printing Technical Paper
iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper
The Effect Of Filling Via-In-Pad On Voiding Rates In PWB Assembly For BGA Components Technical Paper
Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability (SMTAI Oct 2010) Technical Paper
A Procedure to Determine Head in Pillow Defect and Analysis of Contributing Factors SMTAI Oct 2010
SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03 Technical Paper
High Density Fine Feature (APEX 2001) Technical Paper
TP-Method of Eval ICT Probe Penetrability (Apex 06)-CNP-WWE-SM000 06-01-02 Technical Paper
TP-Halogens in Lead Free Solder Paste (SMTA 2009) - WWE SM000-4 10-04-15 Technical Paper
RF Characterization of No Clean Solder Flux Residues Technical Paper
Fine Feature Print (APEX 2003) Technical Paper
RoHS / REACH / Environmental
RoHS ALPHA® CVP520 Solder Paste 42Sn57.6Bi04Ag
Halogen Content Report
CVP 520 Halogen Content Report

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