ALPHA® OM-338-T

Solder Paste

ALPHA® OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA® OM-338-T yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. Example Test Text.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

Product Documentation

Technical Bulletin: ALPHA OM-338-T Technical Bulletin
Application Bulletin: AB - Print Parameters - CNP - WWE - Print Parameters 06-03-02 Application Bulletin; AB - Dual Alloy Soldering - WWE - SM1044 10-11-05 Application Bulletin
Reference Bulletin: Stencil Terminology Reference Bulletin; Visual Inspection Standards Reference Bulletin; RB-Solder Paste Handling Guidelines AM-CNP-USE-SM000-1 08-06-27. Reference Bulletin; RB-Solder Paste Handling Guidelines AP-CNP-USE-SM000-1 10-10-14 Reference Bulletin - Chinese; Aperture Shapes Reference Bulletin; RB-OM-340 Cleaning CNP WWE SM1054. 11.02.18 Reference Bulletin; RB-OM-340 dispense paste handling guidelines Reference Bulletin
Technical Paper: Printing Tutorial (CSR April 2003) Technical Paper; Real Time Visualization (SMT Jan 2003) Technical Paper; Print & Profile Fine Feature (APEX 2003) Technical Paper; TP-Method of Eval ICT Probe Penetrability of Flux Residues (Apex 06)-CNP-WWE--SM000 06-01-02. Technical Paper; New Dim In Stencil Print (SMTA 2002) Technical Paper; RF Characterization of No Clean Solder Flux Residues Technical Paper; Stencil Design for L-F (SMT2004) Technical Paper; Stencil Printing Basics (A. Johnson) Technical Paper; Analytical Procedures for Portable L-F Alloy Test Data Technical Paper; Small Tapered Apertures (Nepcon 2002) Technical Paper; Solder Paste Qualification Paper Technical Paper; TP-Method of Eval ICT Probe Penetrability (Apex 06)-CNP-WWE-SM000 06-01-02 Technical Paper; Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability (SMTAI Oct 2010) Technical Paper; Four Ways to Reduce Voiding in BGACSP Packages To Substrate Connections (SMTA Oct 2010) Technical Paper; The Effect Of Filling Via-In-Pad On Voiding Rates In PWB Assembly For BGA Components Technical Paper; A Procedure to Determine Head in Pillow Defect and Analysis of Contributing Factors SMTAI Oct 2010; Low silver BGA Paper Technical Paper; A New Angle on Printing Technical Paper; TP-Halogens in Lead Free Solder Paste (SMTA 2009) - WWE SM000-4 10-04-15 Technical Paper; High Density Fine Feature (APEX 2001) Technical Paper; Fine Feature Print (APEX 2003) Technical Paper; iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper; SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03 Technical Paper
RoHS / REACH / Environmental: OM338T Halogen Content Report; TEST DOCUMENT
Halogen Content Report: OM-338T Halogen Content Report