ALPHA® OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA® OM-338-T yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. Example Test Text.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.
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