ALPHA® OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-340'S broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin/lead process.* ALPHA OM-340 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil squares) and high "through-put" applications. Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA® OM-340 is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA® OM-340's capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. *Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead or tin-silver.
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