ALPHA® OM-350 is a lead-free, no-clean solder paste suitable for fine feature printing and reflow using most demanding soak reflow profiles in air and nitrogen atmospheres. The outstanding reflow process window of ALPHA® OM-350 delivers good soldering on OSP-Cu, Immersion Ag, Immersion Sn, ENIG and Lead-Free HASL surface finishes. ALPHA® OM-350’s compliance with ROL0 IPC and IPC Class III voiding classifications ensures maximum long-term product reliability. Compliance to environmental standards, including RoHS allows global application of ALPHA® OM-350.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.