ALPHA® PoP 707
Solder Paste
This NO-CLEAN flux is engineered for use as a dip flux for BGA packages. It delivers even, reproducible volumes of flux onto spheres that have been dipped into the flux. The rheology of the flux allows it to remain on the dipped spheres during post flux placement of sub-assemblies, while allowing for easy leveling of the flux bath. This flux was developed to enable the pre-assembly of stacked BGA packages, prior to reflow.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.
- Product Documentation
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- Technical Bulletin
- TBPOP707