ALPHA® WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead free alloy solder paste.
ALPHA® WS-820 was formulated to meet the requirements of water soluble solder lead free applications, and it was developed to increase the reflow profile window of WS-819, while offering exceptional post reflow cleanability and low BGA voiding.
This paste is designed to enable users of ALPHA® WS-609, WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.