ALPHA® WS-820

Solder Paste

ALPHA® WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead free alloy solder paste.

ALPHA® WS-820 was formulated to meet the requirements of water soluble solder lead free applications, and it was developed to increase the reflow profile window of WS-819, while offering exceptional post reflow cleanability and low BGA voiding.

This paste is designed to enable users of ALPHA® WS-609, WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

Product Documentation

Technical Bulletin: ALPHA WS-820 Water Soluble Solder Paste Technical Bulletin (English); ALPHA WS-820 Water Soluble Solder Paste Technical Bulletin (Chinese)
Product Guide: ALPHA WS-820 Water Soluble Solder Paste Product Guide
Application Bulletin: AB - Print Parameters - CNP - WWE - Print Parameters 06-03-02 Application Bulletin; AB - Dual Alloy Soldering - WWE - SM1044 10-11-05 Application Bulletin
Reference Bulletin: Stencil Terminology Reference Bulletin; Visual Inspection Standards Reference Bulletin; RB-Solder Paste Handling Guidelines AM-CNP-USE-SM000-1 08-06-27. Reference Bulletin; RB-Solder Paste Handling Guidelines AP-CNP-USE-SM000-1 10-10-14 Reference Bulletin - Chinese; Aperture Shapes Reference Bulletin; RB-OM-340 Cleaning CNP WWE SM1054. 11.02.18 Reference Bulletin; RB-OM-340 dispense paste handling guidelines Reference Bulletin
Technical Paper: Printing Tutorial (CSR April 2003) Technical Paper; Real Time Visualization (SMT Jan 2003) Technical Paper; Print & Profile Fine Feature (APEX 2003) Technical Paper; TP-Method of Eval ICT Probe Penetrability of Flux Residues (Apex 06)-CNP-WWE--SM000 06-01-02. Technical Paper; New Dim In Stencil Print (SMTA 2002) Technical Paper; RF Characterization of No Clean Solder Flux Residues Technical Paper; Stencil Design for L-F (SMT2004) Technical Paper; Stencil Printing Basics (A. Johnson) Technical Paper; Analytical Procedures for Portable L-F Alloy Test Data Technical Paper; Small Tapered Apertures (Nepcon 2002) Technical Paper; Solder Paste Qualification Paper Technical Paper; TP-Method of Eval ICT Probe Penetrability (Apex 06)-CNP-WWE-SM000 06-01-02 Technical Paper; Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability (SMTAI Oct 2010) Technical Paper; Four Ways to Reduce Voiding in BGACSP Packages To Substrate Connections (SMTA Oct 2010) Technical Paper; The Effect Of Filling Via-In-Pad On Voiding Rates In PWB Assembly For BGA Components Technical Paper; A Procedure to Determine Head in Pillow Defect and Analysis of Contributing Factors SMTAI Oct 2010; Low silver BGA Paper Technical Paper; A New Angle on Printing Technical Paper; TP-Halogens in Lead Free Solder Paste (SMTA 2009) - WWE SM000-4 10-04-15 Technical Paper; High Density Fine Feature (APEX 2001) Technical Paper; Fine Feature Print (APEX 2003) Technical Paper; iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper; SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03 Technical Paper