Alpha® Vaculoy SACX Plus 0107

Wave Solder Bar

ALPHA® Vaculoy SACX Plus™0107 is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX Plus™0100 variant is used to stabilize / reduce the copper content in the wave solder bath, this requirement will depend on process conditions. As with all Alpha Metals bar solder, Alpha’s proprietary Vaculoy™ alloying process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of 3 minor elements to reduce dross formation, improve the joint cosmetics and hole fill.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

Product Documentation

Technical Bulletin: TB-SACXPlus0107_BAR_WWE_SM994-1_09-12-03
Product Guide: PG-SACX0107-BAR-WWE 072408-updated 5_5; PG-SACX0107-BAR-WWC-SM000 10-05-27 CHN
Product Feature: SACX 0107 Product Flyer
Reference Bulletin: Reference Bulletin - SACX Anti-Oxidant Additive; Reference Bulletin - SACX Patent and Trademark_CHN; Reference Bulletin - SACX Plus naming; Reference Bulletin - Mixing Lead-Free alloys_CHN; RB Stainless Steel Erosion Nov 2005; Reference Builletin - SACX Patent and Trademark; Reference Bulletin - Mixing Lead-Free alloys; SACX Wetting versus SAC0307; SACX Wetting versus SAC0307_CHN; Wechsel von SAC auf SACX GER; SACX Test Report Pentagal; Reference Bulletin - Wave Set up to Minimize Dross; Reference Bulletin - Wave Set up to Minimize Dross_CHN; SACX Patent and Trademark Customer Letter_CHN; Edelstahlkorrosion GER; Hole Fill - SACX Performance; Changing from SAC305 to SACX; ALPHA Vaculoy SACX0307- WAVE goodbye to INFERIOR yields; Auswahl bleifreier Legierungen GER; Bleigehalt GER; Mischen unterschiedlicher bleifreier GER; RB-Changing Wave Solder bath from Sn-Pb to Lead-Free-BAR-WWE; RB Lead-Free Solders - Lead Content; Lead-Free Alloy Impurity Action Levels_CHN; Hole Fill - SACX Performance_CHN; Lead-Contamination Advice; Lead-Free Alloy Impurity Action Levels
Technical Paper: TP-Development of a L-F Wave Solder Alloy Campbell-Ingham-B; TP-Effect of Voiding in Solder Interconnections LF Technical Subcommittee-Bar-WWE-SM000 05-12-01; TP-Lead-free Wave Solder Alloy Selection Campbell-Boone-Palacio-BAR-WWE-SM000 05-09-01; SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03; Drop Shock Reliability of Lead Free Alloys - Effect of Micro Additives - ECTC 2007; Effect of silver in common lead-free alloys_paper_Eng042309; Pb-Free_Alloys_Paper
Press Release: SACX Sales Trend Global