ALPHA® Bar Vaculoy SAC 305 & 405

Wave Solder Bar

Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5 are lead-free alloys suitable for use as a replacement for Sn63 alloy. The Sn97Ag3 and Sn96Ag4 variants are used to stabilize / reduce the copper content in the wavesolder bath, this requirement will depend on process conditions. As with all Alpha Metals bar solder, Alpha’s proprietary Vaculoy® alloying process is used to remove certain impurities, particularly oxides.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

Product Documentation
Technical Bulletin
Alpha Vaculoy SAC 305 405 Techincal Bulletin (English)
Alpha Vaculoy SAC 305 405 Bar Techincal Bulletin (Chinese)
Reference Bulletin
Auswahl bleifreier Legierungen GER
Bleigehalt GER
Reference Bulletin - SACX Patent and Trademark_CHN
Reference Bulletin - SACX Plus naming
ALPHA Vaculoy SACX0307- WAVE goodbye to INFERIOR yields
Reference Bulletin - Wave Set up to Minimize Dross
SACX Wetting versus SAC0307
SACX Wetting versus SAC0307_CHN
Wechsel von SAC auf SACX GER
Reference Bulletin - Wave Set up to Minimize Dross_CHN
SACX Patent and Trademark Customer Letter_CHN
SACX Test Report Pentagal
Hole Fill - SACX Performance_CHN
Lead-Contamination Advice
Mischen unterschiedlicher bleifreier GER
Changing from SAC305 to SACX
Edelstahlkorrosion GER
Hole Fill - SACX Performance
RB Lead-Free Solders - Lead Content
Reference Bulletin - Mixing Lead-Free alloys
Reference Bulletin - Mixing Lead-Free alloys_CHN
Reference Bulletin - SACX Anti-Oxidant Additive
RB Stainless Steel Erosion Nov 2005
RB-Changing Wave Solder bath from Sn-Pb to Lead-Free-BAR-WWE
Reference Builletin - SACX Patent and Trademark
Technical Paper
TP-Development of a L-F Wave Solder Alloy Campbell-Ingham-B
TP-Effect of Voiding in Solder Interconnections LF Technical Subcommittee-Bar-WWE-SM000 05-12-01
TP-Lead-free Wave Solder Alloy Selection Campbell-Boone-Palacio-BAR-WWE-SM000 05-09-01
Drop Shock Reliability of Lead Free Alloys - Effect of Micro Additives - ECTC 2007
Effect of silver in common lead-free alloys_paper_Eng042309
RoHS / REACH / Environmental
RoHS ALPHA® Solder SAC350 Alloy
RoHS ALPHA® Solder Alloy SAC 305
RoHS ALPHA® CVP 380 SAC305 Solder Paste
Press Release
SACX Sales Trend Global

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