Posted on: October 09, 2012
by Tom Hunsinger
Conversations with OEMs and Component Suppliers clearly indicate that the market opportunity for low temperature soldering will continue to accelerate. Aspen, our new interactive PC-based software app, is designed to help electronics assemblers determine if low temperature processing is a good "fit for use" or value creator for their process.
Posted on: July 24, 2012
by Paul Koep
ALPHA ® Exactalloy Tape & Reel Preforms are an economical answer to selectively and accurately increasing solder volume on an SMT pad or through-hole pin when overprinting is limited or not possible.
Posted on: June 29, 2012
by Mitch Holtzer
Customer demands are driving electronics assemblers and OEMs to develop more robust electronic devices. Terms like1
Shockproof, Waterproof, Freezeproof and Dustproof have significant impact on the materials of construction to be considered particularly when designing mobile consumer electronics. As consumers’ demands have evolved and the electronic OEMs continue to pursue sustainable sources of differentiation, “tough electronics’” is becoming an increasing part of the Assembly Electronic lexicon.